Intel Core i7 10th Gen - Core i7-10700K Comet Lake 8-Core 3.8 GHz LGA 1200 125W Desktop Processor w/ Intel UHD Graphics 630
Pros: First off, I'm upgrading from a I7-4790K (4.7GHz OCed). The 4790K I have is 5 years old. That CPU is a true beast, but I felt like it was time to get a new MB/CPU/RAM due to age. So, that said, I see a huge difference in desktop work and games. I mainly game. I don't understand why everyone says these CPU's run hot. I'm running stable at 5.2 on an AIO and this CPU doesn't even break 40c-70c in some benchmarks or games. It runs way cooler than my 88w 4790K. I am using an Aorus Ultra MB. If you are coming from a way older generation Intel or AMD, this CPU will not disappoint!
Cons: Cons. I didn't want to wait for however long for the KF series, so I paid the extra for the K. That has nothing to due with how this CPU performs. So, not really a con. (I tried to find one)
Overall Review: Overall, this is a fantastic CPU. I've owned both AMD and Intel through out my 42 years. If you are coming from a much older Intel gen CPU, I recommend it fully. If you have 9th gen I7-I9, I wouldn't recommend.
Intel Core i7-10700K review: specs and price
Why is Intel Core i7-10700K better than the average?
- CPU speed?
8 x 3.8GHzvs11.34GHz
- RAM speed?
- CPU threads?
- L2 cache?
- Semiconductor size?
- PassMark result?
- Turbo clock speed?
- L3 cache?
Cheap alternatives for Intel Core i7-10700K
A 32-bit operating system can only support up to 4GB of RAM. 64-bit allows more than 4GB, giving increased performance. It also allows you to run 64-bit apps.
Small semiconductors provide better performance and reduced power consumption. Chipsets with a higher number of transistors, semiconductor components of electronic devices, offer more computational power. A small form factor allows more transistors to fit on a chip, therefore increasing its performance.
The thermal design power (TDP) is the maximum amount of power the cooling system needs to dissipate. A lower TDP typically means that it consumes less power.
Peripheral Component Interconnect Express (PCIe) is a high-speed interface standard for connecting components, such as graphics cards and SSDs, to a motherboard. Newer versions can support more bandwidth and deliver better performance.
If the CPU exceeds the maximum operating temperature then problems such as random resets can occur.
DirectX is used in games, with newer versions supporting better graphics.
A higher transistor count generally indicates a newer, more powerful processor.
OpenGL is used in games, with newer versions supporting better graphics.
The CPU speed indicates how many processing cycles per second can be executed by a CPU, considering all of its cores (processing units). It is calculated by adding the clock rates of each core or, in the case of multi-core processors employing different microarchitectures, of each group of cores.
More threads result in faster performance and better multitasking.
A larger L2 cache results in faster CPU and system-wide performance.
When the CPU is running below its limitations, it can boost to a higher clock speed in order to give increased performance.
A larger L3 cache results in faster CPU and system-wide performance.
A larger L1 cache results in faster CPU and system-wide performance.
More data can be stored in the L2 cache for access by each core of the CPU.
Some processors come with an unlocked multiplier which makes them easy to overclock, allowing you to gain increased performance in games and other apps.
More data can be stored in the L3 cache for access by each core of the CPU.
It can support faster memory, which will give quicker system performance.
More memory channels increases the speed of data transfer between the memory and the CPU.
Error-correcting code memory can detect and correct data corruption. It is used when is it essential to avoid corruption, such as scientific computing or when running a server.
The bus is responsible for transferring data between different components of a computer or device.
DDR (Double Data Rate) memory is the most common type of RAM. Newer versions of DDR memory support higher maximum speeds and are more energy-efficient.
A higher version of eMMC allows faster memory interfaces, having a positive effect on the performance of a device. For example, when transferring files from your computer to the internal storage over USB.
The bus is responsible for transferring data between different components of a computer or device.
AES is used to speed up encryption and decryption.
AVX is used to help speed up calculations in multimedia, scientific and financial apps, as well as improving Linux RAID software performance.
SSE is used to speed up multimedia tasks such as editing an image or adjusting audio volume. Each new version contains new instructions and improvements.
NEON provides acceleration for media processing, such as listening to MP3s.
F16C is used to speed up tasks such as adjusting the contrast of an image or adjusting volume.
Multithreading technology (such as Intel's Hyperthreading or AMD's Simultaneous Multithreading) provides increased performance by splitting each of the processor's physical cores into virtual cores, also known as threads. This way, each core can run two instruction streams at once.
MMX is used to speed up tasks such as adjusting the contrast of an image or adjusting volume.
The CPU can decode more instructions per clock (IPC), meaning that the CPU performs better
A technology integrated into the processor to secure the device for use with features such as mobile payments and streaming video using digital rights management (DRM).
This benchmark measures the performance of the CPU using multiple threads.
Geekbench 5 is a cross-platform benchmark that measures a processor's multi-core performance. (Source: Primate Labs, 2021)
Geekbench 5 is a cross-platform benchmark that measures a processor's single-core performance. (Source: Primate Labs, 2021)
The Blender (bmw27) benchmark measures the performance of a processor by rendering a 3D scene. More powerful processors can render the scene in less time.
The Blender (classroom) benchmark measures the performance of a processor by rendering a 3D scene. More powerful processors can render the scene in less time.
Which are the best CPUs?
AMD Ryzen Threadripper Pro 3995WX
AMD Ryzen Threadripper 3990X
AMD Ryzen Threadripper 3970X
AMD Ryzen Threadripper 3960X
AMD Ryzen Threadripper 2950X
Intel's Comet Lake has cratered into the market, bringing more threads to the company's Core i5 and i7 lineups along with more cores for the halo Core i9 family. In response to AMD's unrelenting pressure, Intel's revamped lineup offers more threads for the same pricing as previous-gen models. The Core i7-10700K slots in with eight cores and 16 threads for and MSRP of $374 / $349 (without GPU), though current street prices are higher. In fact, the 10700K offers the same number of cores and threads as the previous-gen Core i9-9900K, but for $114 less, making it a contender for our list of Best CPUs and a top-performer on our CPU Benchmark Hierarchy.
As expected, Intel reserved the best features for its halo Core i9-10900K, like support for its Thermal Velocity Boost that triggers higher boost speeds if the chip runs below a certain temperature. However, the Core i7-10700K still marks the debut of Turbo Max 3.0 to the Core i7 family. This tech targets the 10700K's two fastest cores, which peak at 5.1 GHz, with lightly threaded workloads to improve snappiness. That results in a surprisingly close competition for gaming supremacy between the Core i7-10700K and the Core i9-10900K.
The Intel Core i7-10700K also comes with a 3.8-GHz base clock that, paired with its 16 threads, improves its standing against price-comparable Ryzen processors in threaded desktop PC applications, while the snappy single-threaded performance gives it an outright win in lightly-threaded apps. The Core i7-10700K also proves to be a nimble overclocker that doesn't generate an untenable amount of excess heat, so off-the-shelf water coolers can unlock big gains.
Overall, the Core i7-10700K gives you nearly the same gaming performance as the Core i9-10900K, but for $110 less, and overclocking eliminates any meaningful difference in gaming performance between the chips. You also get extremely competitive single-threaded performance at stock settings.
AMD isn't sitting still, though. The company recently announced a new line of Ryzen XT processors that should bring slight performance improvements over the existing chips. Still, more importantly, the pending chips have resulted in lower pricing on the existing processors. The competing $300 Ryzen 7 3700X isn't as adept in gaming and only holds a slight edge in creativity applications, so it slots in as a lower-cost alternative. Meanwhile, the Ryzen 9 3900X retails for a fantastic $415, and its 12 cores offer far more performance in threaded workloads, making it the go-to productivity chip.
The Core i7-10700K leads in gaming, but cost-conscious shoppers may prefer Intel's own Core i5-1600K, which is a better value for lower-cost gaming rigs. This leaves the Core i7-10700K as a good choice for high-end gaming machines, and it definitely takes the shine off Intel's Core i9-10900K (and its egregious power consumption) for overclocking enthusiasts and the frame-rate obsessed.
Intel Core i7-10700K Specifications and Pricing
|MSRP/Retail||Cores / Threads||Base / Boost GHz||$-Per-Core / Per Thread||L3 Cache||TDP||PCIe||Memory||Graphics|
|Ryzen 9 3950X||$749 / $700||16 / 32||3.5 / 4.7||~$44/~$22||64||105W||24 Gen4||Dual DDR4-3200||N/A|
|Ryzen 9 3900X||$413 / $419||12 / 24||3.8 / 4.6||~$35/~$17||64||105W||24 Gen4||Dual DDR4-3200||N/A|
|Core i9-10900K / KF||$488 (K) / $472 (KF)||10 / 20||3.7 / 5.3||~$49/~$24 / ~$47/~$24||20||125W||16 Gen3||Dual DDR4-2933||UHD 630 - 1.2 GHz (non-F only)|
|Core i9-9900K / F||$488 / $524||8 / 16||3.6 / 5.0||~$61/~$31||16||95W||16 Gen3||Dual DDR4-2666||UHD 630 - 1.2 GHz (non-F only)|
|Core i7-10700K / KF||$374 (K) / $349 (KF)||8 / 16||3.8 / 5.1||~$47/~$23 / ~$44/~$22||16||125W||16 Gen3||Dual DDR4-2933||UHD 630 - 1.2 GHz (non-F only)|
|Core i7-9700K||$374 / $370||8 / 8||3.6 / 4.9||$~47/~$47||12||95W||16 Gen3||Dual DDR4-2666||UHD 630 - 1.2 GHz (non-F only)|
|Ryzen 7 3800X||$399 / $329||8 / 16||3.9 / 4.5||~$41/~$21||32||105W||24 Gen4||Dual DDR4-3200||N/A|
|Core i7-10700 / F||$323 / $298 (F)||8 / 16||2.9 / 4.8||~$40/~$20 / ~$37/~$19||16||65W||16 Gen3||Dual DDR4-2933||UHD 630 - 1.2 GHz (non-F only)|
|Ryzen 7 3700X||$329 / $275||8 / 16||3.6 / 4.4||~$34/~$17||32||65W||24 Gen4||Dual DDR4-3200||N/A|
The Comet Lake architecture, which comes with the 14nm++ process, is yet another Skylake derivative, meaning most performance gains come from added features and clock rate improvements. We've covered the finer details here.
The biggest change to the Core i7 series comes in the form of more threads at the same price points as previous-gen i7 models, which equates to a lower price-per-thread. Intel's graphics-less F-series 10700K also stands out with a $25 discount.
The 10700K doesn't have a direct Ryzen 3000 competitor on the pricing front yet, with the ~$415 Ryzen 9 3900X serving as a step up with 12 cores and 24 threads, while the $329 Ryzen 7 3800X lands at a lower price point. We expect that to change when AMD releases its Radeon XT models, with the $399 Ryzen 7 3800XT serving as the 10700K's direct competitor.
In many respects, the Core i7-10700K is similar, if not better, than the previous-gen Core i9-9900K. Both chips come with eight cores and 16 threads, but the 10700K has higher 3.8 / 5.1 GHz base/boost clocks, while the Core i9-9900K tops out at 3.6 / 5.0 GHz. Both chips have the same 4.7 GHz all-core boost.
|Turbo Boost Matrix||Base (GHz)||Turbo Boost 2.0 (single-core)||Turbo Boost 3.0 Max (Dual-Core)||Thermal Velocity Boost (TVB - Single Core)||All-Core Boost||TVB All-core|
|Core i9-10900K / KF||3.7 GHz||5.1 GHz||5.2 GHz||5.3 GHz||4.8 GHz||4.9 GHz|
|Core i7-10700K||3.8 GHz||5.0 GHz||5.1 GHz||N/A||4.7GHz||N/A|
|Core i7-9700K||3.6 GHz||4.9 GHz||N/a||N/A||4.6 GHz|
|Core i9-9900K / F||3.6 GHz||5.0 GHz||N/A||N/A||4.7 GHz||N/A|
The Core i7-10700K gains the extra 100 MHz in boost frequency over the 9900K via Intel's Turbo Boost Max 3.0 tech, which targets the two fastest physical cores (identified during the binning process) and targets them with lightly-threaded applications.
|Active Cores||1-2||3||4 - 5||6 - 8|
Intel fabs both the Core i9-9900K and Core i7-10700K with a similar process and architecture, but the 10700K consists of the ten-core die with two cores fused off to create an eight-core part. Intel gives the 10700K a 125W TDP rating, which is a substantial increase over the 9900K's 95W. Intel specs the TDP rating at base clocks, so the company made a few alterations, including pairing a thinner die and copper integrated heat spreader (IHS) with solder TIM to help accommodate the higher heat output. Intel also bumped up the PL2 (Power Limit 2) rating that reflects power draw during boost activity to 229W, which is a big jump over the 9900K's 119W rating.
Intel bumped up its memory support over the previous-gen models from DDR4-2666 to DDR4-2933, a minor improvement, and you'll need a Z490 motherboard with the LGA1200 socket to accommodate the chip. Luckily, all 115x cooling solutions are compatible. As with the chip's other ratio multipliers, Intel fully enables memory overclocking on Z-series motherboards, but you'll lose that functionality on the B- and H-series. Be sure to price in a Z-series board and a cooling solution, preferably liquid, if you're off to the overclocking races. Meanwhile, AMD allows overclocking on all but its A-Series motherboards.
The Core i7-10700K doesn't come with a boxed cooler like the competing Ryzen chips, but mid-range air coolers should be sufficient for stock operation, and even some overclocking. Serious overclockers should plan on a 240mm or greater all-in-one cooler, but the overclocking results we'll outline on the following pages are pretty impressive.
Paul Alcorn is the Deputy Managing Editor for Tom's Hardware US. He writes news and reviews on CPUs, storage and enterprise hardware.
The date the product was first introduced.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
# of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
# of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
Intel® Turbo Boost Max Technology 3.0 Frequency ‡
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom. Intel® Turbo Boost Max Technology 3.0 frequency is the clock frequency of the CPU when running in this mode.
Intel® Turbo Boost Technology 2.0 Frequency‡
Intel® Turbo Boost Technology 2.0 Frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Configurable TDP-down Frequency
Configurable TDP-down Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Base Frequency is where the Configurable TDP-down is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Processor Graphics ‡
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Processor graphics brands include Intel® Iris® Xe Graphics, Intel® UHD Graphics, Intel® HD Graphics, Iris® Graphics, Iris® Plus Graphics, and Iris® Pro Graphics. See the Intel® Graphics Technology for more information.
Intel® Iris® Xe Graphics only: to use the Intel® Iris® Xe brand, the system must be populated with 128-bit (dual channel) memory. Otherwise, use the Intel® UHD brand.
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
Graphics Video Max Memory
The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).
4K support indicates the product's support of 4K resolution, defined here as minimum 3840 x 2160.
Max Resolution (HDMI)‡
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (DP)‡
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (eDP - Integrated Flat Panel)‡
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
Intel® Quick Sync Video
Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.
Intel® InTru™ 3D Technology
Intel® InTru™ 3D Technology provides stereoscopic 3-D Blu-ray* playback in full 1080p resolution over HDMI* 1.4 and premium audio.
Intel® Clear Video HD Technology
Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
Intel® Clear Video Technology
Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this processor.
Junction Temperature is the maximum temperature allowed at the processor die.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Thermal Velocity Boost
Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.
Intel® Turbo Boost Max Technology 3.0 ‡
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.
Intel® Turbo Boost Technology ‡
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel vPro® Platform Eligibility ‡
The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vPro®
Intel® Hyper-Threading Technology ‡
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® VT-x with Extended Page Tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® Transactional Synchronization Extensions
Intel® Transactional Synchronization Extensions (Intel® TSX) are a set of instructions that add hardware transactional memory support to improve performance of multi-threaded software.
Intel® 64 ‡
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Identity Protection Technology ‡
Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.
Intel® Stable Image Platform Program (SIPP)
The Intel® Stable Image Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
.AMD 5600X vs Intel 10700k - Mid Range CPU Battle!
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